T^3 Mark, Inc. - Creative LED Lighting with Tomorow's Technology Today

Principals with over 20 years of electronics and mechanical manufacturing experience focusing in LED market in past 6 years. Custom made LED Light Engines including LED modules, Drivers and Heat Sinks. Innovative Engineering Services Quick Turn Prototype Development Local Metal Core Printed Circuit Board (MCPCB) Fabrication Facility Flexible Manufacturing facilities in the United States and Overseas Inventory of standard size MCPCBs for quick assembly with any LED specified by customer. Industry's first MCPCBs with universal LED mounting pads.	T^3 Mark, Inc. has established strategic relations with a group of talented, experienced and visionary engineers in all aspects of LED lighting technology. To achieve a successful implementation of any high bright LED lighting project, detailed attention is to be paid to the following:LED (selection based on the application) Substrate (Metal Core PCB design and fabrication) Power supply (Constant current LED drivers) Heat dissipation (Heat sink design and fabrication) Light managemet (Lenses and reflectors) Packaging (Enclosure design assist) T^3 can offer support and assistance on all of the above.
LEDs: Selection of LEDs is ultimately a decision made by our ustomers. T^3 engineers offer assistance in the selection process based on specific application requirements. T^3 is proud to suggest using premium quality LEDs of the following manufactureres: Cree: www.cree.com Lumileds: www.lumileds.com MCPCB: The Metal Core PCBs are designed per customer's specific needs and are fabricated from T^3's properietary materials. T^3 MCPCB Specifications are as follows: Copper foil thickness: Std. 1 Oz (.035 mm, .0014 in) Also avaialbe in 2, 3 and 4 Oz Dielectric Layer min. thickness: 4 mil (0.10 mm, 0.004 in) Thermal Impedance: 1013 Thermal Conductivity: 1.5 W/m-K Breakdown Voltage: 2 kV AC Dielectric Constant: 3.0 at 1 kHz Peel Strength: 2.8 N/mm (16 PPI) Flame Resistance: UL 94 V0 Service Temperature: -75 to +450 F 3003H24 Aluminum: Std. 0.062” (1.5 mm) Thk. Also available in 0.5mm, 0.8mm, 1.0mm, 2.0mm, 2.5mm and 3.0mm Overall thermal conductivity: Min. 200 W/m-K Suggested surface finish: HASL(Hot Air Solder Level	T^3 Mark, Inc. has qualified (2) local and (2) overseas manufacturing facilities for it’s Metal Core PCB assemblies: First local facility is in Sothern California, Ventura County with 10,000 automatic placements per hour capacity (for prototypes and small runs up to 5,000 assemblies per order) Another local manufacturing company in Sothern California with 100,000 placements per hour capacity (for production runs up to 100,000 assemblies per order) Two manufacturing companies in China (for more than 100,000 assemblies per run) We have also formed strategic relations with metal forming companies to produce high quality but economical heat sinking solutions with Aluminum extrusions and castings. Examples of some of the custom made products are shown in Heat Sink catagory of the Products section.